Infineon erected a new production building on its factory premises in Dresden. The new building is embedded between the existing buildings. The planned new building consists of a first floor, floor 2, and 3 upper floors, floor 3, floor 4 and floor 5. The building has a ground plan length of around 28.5 m and a width of around 24.5 m, and is around 25.5 m high. 

The new construction is planned as an extension of the existing structure to the south. During the planning and construction of the HVE Implanter Bridge to the south, a possible extension to the north was already included in the planning. With the exception of the supporting structure in corridor 5, the supporting structure of the new building is made entirely of solid reinforced concrete, consisting of ceiling slabs, beams, columns and wall panels. The supporting structure in corridor 5 is planned as a steel structure. The decisive factor for the choice of construction is the construction of a clean room in corridor 4, whose ceiling load transfer must be via the uppermost building ceiling. The construction of the floor slab of corridor 4 with its perforated structure ensures heat dissipation and easy access to the clean room's access lines.